E-Linking potting and encapsulation compounds feature exceptionally low viscosities and are easy to apply.From power supplies to connectors to sensors and relays, E-linking potting and encapsulation compounds optimize performance and provide easy processing. Our line of products consists of epoxies, silicones, polyurethanes and UV curable systems. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance.
Properties of Potting and Casting Systems
Our technologically advanced potting and encapsulation materials are designed to resist exposure to hostile environmental conditions. They offer the following advantages:
High voltage insulation
Enhanced thermal management properties
Exceptionally low coefficients of thermal expansion
Thermal shock resistance
Cryogenic serviceability
Special Potting and Encapsulation Formulations
Some of our compounds have been formulated to meet strict industry standards, including:
UL 94V-0 for flame resistance
NASA low outgassing
USP Class VI for medical use
FDA CFR 175.300 for food grade
Ferrites
